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Packaging Engineer II at Ayar Labs
Santa Clara, CA, US
The Packaging Engineer will work as a part of a small team in a dynamic environment, driving package design and optimizing for thermal, mechanical, electrical, and optical requirements, taking the design from concept to production.
 
Essential Functions:
  • Developing a range of compatible packaging concepts in coordination with the finalized products or materials
  • Work with all internal teams to evaluate packaging requirements at all developmental phases.
  • Develop engineering and manufacturing specifications
  • Review design efficiency to ensure the best transition between the design and manufacturing processes
  • Conduct in-depth investigations into the latest trends, pricing architectures, and any potential obstacles that may come up during the testing stage
  • Prepare documentation in line with engineering protocols and regulations, and ensure that the manufacturing specifications are compliant 
  • Interface with suppliers 
  • Provide technical guidance and support, reliability.  
  • Manage his or her own time to take projects to completion with limited supervision and guidance.
Basic Requirements
  • BS or MS in Mechanical Engineering, Electrical Engineering, Materials Science and Engineering, or equivalent skills and/or experience;
  • Minimum 3+ years of experience in advanced microelectronics packaging, MCM, 2.5D, 3D, etc.;
  • Experience collaborating with assembly service providers (i.e. OSATs);
  • Experience in processes and materials development, design of experiment,
Preferred Qualifications
  • Fiber optic or photonic package experience;
  • Proficiency with ANSYS FEA, or other FEA tools
  • Experience with high speed SerDes packaging
 
"Principals only. Recruiters, remuneration  for recruiting activities is only applicable subject to a signed and executed agreement between the parties. Please don’t contact our hiring managers."
 
About Ayar Labs
At Ayar Labs we’re about to revolutionize computing by moving data with light.  We’re unleashing processing power for artificial intelligence, high performance computing, and telecommunications by removing the bottlenecks created by today’s electrical I/O -- making it possible to continue scaling computing system performance.  Ayar Labs is the first to deliver in-package optical I/O chiplets, a new universal I/O solution that replaces traditional electrical I/O and enables chips to communicate with each other from millimeters to kilometers, to deliver orders of magnitude improvements in latency, bandwidth density, and power consumption.

With our strong collaborations with industry leaders and government, our deep ties to MIT and UC Berkeley, and our commitment to hiring the best engineers in photonics and electronics, joining our team gives you the opportunity to collaborate with renowned experts on challenging, paradigm-shifting work.

We are passionate about delivering in-package optical I/O at scale, leveraging the strength of our patent portfolio and our team of leading interdisciplinary experts.  We believe that deep cross-collaboration between teams facilitated by honest, open debate is the best way to drive innovation and achieve big wins.   Join our team and experience the possibilities.

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Ayar Labs is an Affirmative Action/Equal Opportunity Employer and is strongly committed to all policies which will afford equal opportunity employment to all qualified persons without regard to age, national origin, race, ethnicity, creed, gender, disability, veteran status, or any other characteristic protected by law.